Gigadapters Motherboards

DISCONTINUED

This product has been discontinued. The information on this page is for reference only, and no new orders will be accepted.

There are three Gigadapter motherboards available. Each is supplied with a power jack and a power cable. The component side has a ground plane. Each motherboard can accommodate a variety of Gigadapter combinations:

Model	Gigadapter Sites			Connector Footprints
Model	A-type	B-type	C-type	SMA/ BNC	Volt. Reg & AC jack	Other
970-3.8	3	2	0	8 SMA	Yes	8-pos DIP switch
970-3.8A	11	0	0	6 SMA/ BNC	Yes	Uncommitted space for PRL I/O SIP adapters
980-8	20	4	2	8 SMA/ BNC	Yes	Large uncommitted areas for PRL I/O SIP adapters

A sites accept SO or SSO device adapters from 8 to 30 pins, depending on the motherboard. A sites are continuous, and will accept a varying number of SO/SSO device adapters depending on size. Best-case adapter count is shown, based on SO8 adapters.
B sites accept PLCC/LCC device adapters from 20 to 28 pins, or a QFP-32 adapter. B sites will also accept SO/SSO adapters up to 30 pins.
C sites will accept QFP device adapters from 44 to 64 pins, or SO/SSO adapters up to 30 pins.

All boards are laid out on a 100-mil grids, allowing for placement of all standard through-hole components, connectors and I/O SIP adapters

GD-970-3.8

GD-970-3.8 Motherboard (top): 2.8-in.W x 3.7-in. L

GD-970-3.8 Motherboard (bottom): 2.8-in.W x 3.7-in. L

The GD-970-3.8 motherboard is designed to support PLCC device adapters or the QFP-32 device adapter, plus supporting SO devices.

A sites accept SO device adapters. Two of the sites shown will accept SO8 adapters, and the third will accept an SO8 to SO14 adapter.
B sites accept PLCC/LCC device adapters from 20 to 28 pins, or a QFP-32 adapter. B sites will also accept SO/SSO adapters up to 30 pins.

On-board circuitry supports one of the four optional voltage regulator SIP Modules, to be inserted into locations marked P1, P2 and P3. Eight SMA footprints are also provided.

There are two voltage busses either under or adjacent to each adapter site. Strategically placed ground busses and ground pads are provided for coaxial cable terminations and for power supply decoupling. A footprint for an eight position DIP switch, SW1, is also included.

An SO8 Gigadapter with an MC10EL32 frequency divider was tested for clock rates over 2.5 GHz on this board, using plug-in 50 Ω coaxial interconnect modules, and over 3 GHz using hard-wired coaxial cables.

This board can be used with the PRL-970-3.8 extrusion

GD-970-3.8A

GD-970-3.8A Motherboard (top): 2.8-in.W x 3.7-in. L

GD-970-3.8A Motherboard (bottom): 2.8-in.W x 3.7-in. L

The GD-970-3.8A motherboard shown above is optimized for use with our SO and SSO device adapters.

A sites accept SO or SSO device adapters from 8 to 30 pins. These adapters are DIP packages. A sites are continuous, and will accept a varying number of SO/SSO device adapters depending on size, up to a maximum of eleven SO8 adapters.

Six I/O footprints accept SMA or BNC connectors. On-board circuitry supports one of the four optional voltage regulator SIP Modules, to be inserted into locations marked P1, P2 and P3.

There are two voltage busses directly underneath each adapter site, and ground busses on each side. This facilitates coaxial cable terminations and power supply decoupling for high-speed or low-noise applications.

This board can be used with the PRL-970-3.8 extrusion.

GD-980-8

GD-980-8 Gigadapter Motherboard: 6.6-in. W x 8.0-in. L

The GD-980-8 motherboard has all three types of SMT adapter sites:

A sites accept SO or SSO device adapters from 8 to 30 pins. A sites are continuous, and will accept a varying number of SO/SSO device adapters depending on size, up to a maximum of twenty SO8 adapters.
B sites accept PLCC/LCC device adapters from 20 to 28 pins, or a QFP-32 adapter. B sites will also accept SO/SSO adapters up to 30 pins. There are four B sites.
C sites will accept QFP-44 to QFP-64 device adapters, or SO/SSO adapters up to 30 pins. There are two C sites.

There are two voltage busses under each A adapter site, three under each B site, and four under each C site. Every pin is adjacent to a ground-plane connection, and every pin has a three-pads-per-pin arrangement, so that plug-in coaxial interconnect modules can be used with a pair of stick pins for easy 50 Ω interconnections.

There are dedicated I/O footprints for eight SMA or BNC connectors. On-board circuitry also supports one of five optional voltage regulator SIP Modules.

Two sites on the board are optimized for data I/O. The left edge of the board is optimized for header-type connectors that have matched signal and ground pins for high-speed data. The right edge of the board has two columns of a two-pads-per-pin pattern, suitable for our patented D-connector DIP adapter.

The entire board, except for the power and BNC/SMA footprints, is laid out on a standard 100-mil grid, and can also be used as general breadboarding space.